High Power PIN Diodes

V14

ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.

Commitment to produce in volume is not guaranteed.

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• India Tel: +91.80.4155721

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Visit www.macomtech.com for additional data sheets and product information.

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make

changes to the product(s) or information contained herein without notice.

1

Features

♦ High Power Handling

♦ Low Loss / Low Distortion

♦ Voltage Ratings up to 1000 Volts

♦ Passivated Chip for Low Leakage Current

♦ Low Theta (θ) Due to Full Face Chip Bonding

♦ Leadless Low Inductance MELF Packages

♦ Various Package Options

♦ Available as Chips

♦ Fully RoHS Compliant

♦ Non-Magnetic Packages Available for MRI

Description

M/A-COM Technology Solutions MELF and HIPAX

PIN diode series are designed for usage in switch

and attenuator applications requiring high power

handling and low distortion. The MELF and HIPAX

PIN diodes incorporate a fully passivated PIN diode

chip resulting in an extremely low reverse bias

leakage current. The semiconductor technology

utilized in the MELF and HIPAX families draws on

M/A-COM Tech’s substantial experience in PIN

diode design and wafer fabrication. The result is a

device which has a thick I-region and long carrier

lifetime while maintaining low series resistance and

capacitance values. The chips of the MELF and

HIPAX PIN diodes are enclosed in a rugged

ceramic package and is full face bonded to metal

pins on both the anode and cathode. The result is a

low loss PIN diode with low thermal resistance due

to symmetrical thermal paths. The parts are offered

in either magnetic or non-magnetic, HIPAX (axial

leaded) or Metal Electrode Leadless Faced (MELF)

surface mount packages for MRI applications. The

MELF is a rectangular SMQ, package which is

designed for high volume tape and reel assembly.

This easy to use package design makes automatic

pick and place, indexing and assembly, extremely

easy. The parallel flat surfaces are suitable for most

key jaw or vacuum pick-up techniques. All of the

solderable surfaces are tin plated and compatible

with industry standard reflow and vapor phase

soldering processes. See page 7 of Application

Note M538 on the M/A-COM Technology Solutions

website for a typical solder reflow profile.

Absolute Maximum Ratings

1.Operation of this device above any one of these

parameters may cause permanent damage.

Parameter

Absolute Maximum

(See Tables)

Operating Chip Junction

Temperature

-55°C to +175°C

Storage Temperature

-55°C to +200°C

Installation Temperature

+280°C for 30 Seconds

ESD

Class 1A, HBM

Package Styles

Applications

HIPAX PIN diodes are designed for use in a wide

variety of switch and attenuator applications from HF

through UHF frequencies and at power levels above

1kW, CW. The internal chip as well as each diode

assembly has been comprehensively tested and

characterized to ensure predictable and repeatable

performance.

Design Recommendations

1072 & 1091

Notes

401 & 402