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LP7512 датащи(PDF) 1 Page - Filtronic Compound Semiconductors |
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LP7512 датащи(HTML) 1 Page - Filtronic Compound Semiconductors |
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1 / 2 page ![]() LP7512 ULTRA LOW NOISE PHEMT Phone: (408) 988-1845 http:// www.filss.com Revised: 1/18/01 Fax: (408) 970-9950 Email: sales@filss.com • FEATURES ♦ 0.6 dB Noise Figure at 12 GHz ♦ 12 dB Associated Gain at 12 GHz ♦ Low DC Power Consumption ♦ Excellent Phase Noise • DESCRIPTION AND APPLICATIONS The LP7512 is an Aluminum Gallium Arsenide / Indium Gallium Arsenide (AlGaAs/InGaAs) Pseudomorphic High Electron Mobility Transistor (PHEMT), utilizing an Electron-Beam direct- write 0.25 µm by 200 µm Schottky barrier gate. The recessed “mushroom” gate structure minimizes parasitic gate-source and gate resistances. The epitaxial structure and processing have been optimized for ultra low noise and usable gain to 40 GHz. The LP7512 also features Si3N4 passivation and is available in a variety of packages. Typical applications include low noise receiver preamplifiers for commercial applications including wireless systems and radio link systems. • ELECTRICAL SPECIFICATIONS @ T Ambient = 25 ° °C Parameter Symbol Test Conditions Min Typ Max Units Saturated Drain-Source Current IDSS VDS = 2 V; VGS = 0 V 15 35 50 mA Noise Figure NF VDS = 2 V; IDS = 25% IDSS; f=12 GHz f=18 GHz 0.6 1.0 0.9 1.4 dB dB Associated Gain at minimum NF GA VDS = 2 V; IDS = 25% IDSS; f=12 GHz f=18 GHz 9 7.5 10 8.5 dB dB Transconductance GM VDS = 2 V; VGS = 0 V 60 90 mS Gate-Source Leakage Current IGSO VGS = -3 V 1 10 µA Gate-Drain Leakage Current IGDO VGD = -3 V 1 10 µA Pinch-Off Voltage VP VDS = 2 V; IDS = 1 mA -0.25 -0.8 -1.5 V Thermal Resistivity Θ JC 325 °C/W frequency=18 GHz DRAIN BOND PAD (2X) SOURCE BOND PAD (2x) DIE SIZE: 18.0X13.0 mils (460x330 µm) DIE THICKNESS: 3.9 mils (100 µm) BONDING PADS: 1.9X1.9 mils (50x50 µm) GATE BOND PAD (2X) |
Аналогичный номер детали - LP7512 |
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Аналогичное описание - LP7512 |
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