SiM3U167-B-GDI

Rev. 1.1

13

53

46

PB1.9/TRACECLK

–1765

1157

54

47

PB1.8/ETM3

–1765

1057

55

48

PB1.7/ETM2

–1765

957

56

49

VIO

–1765

860

57

33,75

GND

–1765

771

58

NA

Reserved*

–1765

680

59

50

PB1.6/ETM1

–1765

587

60

51

PB1.5/ETM0

–1765

487

61

52

PB1.4/TDI

–1765

387

62

53

PB1.3/TDO/SWV

–1765

287

63

33,75

GND

–1765

191

64

54

PB1.2/TRST

–1765

95

65

55

PB1.1

–1765

–5

66

56

PB1.0

–1765

–105

67

57

PB0.15

–1765

–335

68

33,75

GND

–1765

–570

69

58

PB0.14

–1765

–1456

70

59

PB0.13

–1765

–1556

71

60

PB0.12

–1765

–1656

72

61

PB0.11

–1586

–1835

73

62

PB0.10

–1486

–1835

74

63

PB0.9

–1386

–1835

75

64

PB0.8

–1286

–1835

76

65

PB0.7

–1141

–1835

77

33,75

GND

–985

–1835

78

66

PB0.6

–889

–1835

Table 3. Bond Pad Coordinates (Relative to Center of Die) (Continued)

Physical Pad

Number

Example Package

Pin Number

(TQFP-80)

Package Pin Name

Physical Pad

X (µm)

Physical Pad

Y (µm)

*Note: Pins marked “Reserved” should not be connected.