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KMPC8315CVRAGDA датащи(PDF) 76 Page - Freescale Semiconductor, Inc

номер детали KMPC8315CVRAGDA
подробное описание детали  PowerQUICC II Pro Processor Hardware Specifications
PDF  106 Pages
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производитель  FREESCALE [Freescale Semiconductor, Inc]
домашняя страница  http://www.freescale.com
Logo FREESCALE - Freescale Semiconductor, Inc

KMPC8315CVRAGDA датащи(HTML) 76 Page - Freescale Semiconductor, Inc

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MPC8315E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
76
Freescale Semiconductor
Package and Pin Listings
This figure shows the TDM transmit signal timing.
Figure 60. TDM Transmit Signals
23 Package and Pin Listings
This section details package parameters, pin assignments, and dimensions. The MPC8315E is available in
a thermally enhanced plastic ball grid array (TEPBGA II), see Section 23.1, “Package Parameters for the
MPC8315E TEPBGA II,” and Section 23.2, “Mechanical Dimensions of the TEPBGA II,” for information
on the TEPBGA II.
23.1
Package Parameters for the MPC8315E TEPBGA II
The package parameters are as provided in the following list. The package type is 29 mm
 29 mm,
TEPBGA II.
Package outline
29 mm
 29 mm
Interconnects
620
Pitch
1 mm
Module height (typical)
2.23 mm
Solder balls
96.5 Sn/3.5 Ag (VR package)
Ball diameter (typical)
0.6 mm
TDMxTCK
TDMxTD
TDMxRCK
TDMxTFS (output)
TDMxTFS (input)
tDM
tDM_HIGH
tDM_LOW
tDMIVKH
tDM_OUTAC
tDMFSIXKH
tDMTKHOV
tDMTKHOX
tDM_OUTHI
tDMFSKHOV
tDMFSKHOX



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