GaAs SPDT Switch

DC - 6.0 GHz

Rev. V6

MASW6010G

4

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Visit www.macomtech.com for additional data sheets and product information.

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make

changes to the product(s) or information contained herein without notice.

ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.

Commitment to produce in volume is not guaranteed.

Handling Procedures

Permanent damage to the MASW6010G may occur

if the following precautions are not adhered to:

A. Cleanliness

-

The MASW6010G should be

handled in a clean environment.

DO NOT

attempt

to

clean

assembly

after

the

MASW6010G is installed.

B. Static Sensitivity - All die handling equipment

and personnel should be DC grounded.

C. Transients

-

Avoid instrument and power

supply transients while bias is connected to the

MASW6010G.

Use shielded signal and bias

cables to minimize inductive pick-up.

D. Bias - Apply voltage to either control port A/B

or only when the other is grounded.

Neither

port should be allowed to “float”.

E. General Handling - It is recommended that the

MASW6010G chip be handled along the long

side of the die with a sharp pair of bent

tweezers.

DO NOT touch the surface of the

chip with fingers or tweezers.

Mounting

The MASW6010G is back-metalized with Pd/Ni/Au

(100/1,000/30,000Å)

metallization.

It

can

be

die-mounted using Au/Sn eutectic preforms or a

thermally conductive epoxy. The package surface

should be clean and flat before attachment.

Eutectic Die Attach:

A. An 80/20 Au/Sn preform is recommended with

a work surface temperature of approximately

255°C and a tool temperature of 265°C. When

hot 90/10 nitrogen/hydrogen gas is applied,

solder temperature should be approximately

290°C.

B. DO NOT expose the MASW6010G to a

temperature greater than 320°C for more than

20 seconds.

No more than 3 seconds of

scrubbing should be required for attachment.

Epoxy Die Attach:

A. Electrically conductive epoxy must be used.

B. Apply a minimum amount of epoxy and place

the MASW6010G into position.

A thin epoxy

fillet should be visible around the perimeter of

the die.

C. Cure epoxy per manufacturer’s recommended

schedule.

Wire Bonding

A. Ball or wedge bond with 1.0 mil diameter pure

gold wire.

Thermosonic wire bonding with a

nominal stage temperature of 150°C and a ball

bonding force of 40 to 50 grams or wedge

bonding force of 18 to 22 grams is recom-

mended. Ultrasonic energy and time should be

adjusted to the minimum levels to achieve

reliable wirebonds.

B. Wirebonds should be started on the chip and

terminated on the package.