DS32kHz

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ABSOLUTE MAXIMUM RATINGS

Voltage Range on Any Pin Relative to Ground

-3.0V to +7.0V

Operating Temperature Range

Commercial

0°C to +70°C

Industrial

-40°C to +85°C

Storage Temperature Range

-40°C to +85°C

Soldering Temperature (BGA)

See IPC/JEDEC J-STD-020A (2x max) (Note 1)

Soldering Temperature, Leads (DIP)

260°C for 10 seconds (Notes 1, 2)

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only,

and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is

not implied. Exposure to the absolute maximum rating conditions for extended periods may affect device.

RECOMMENDED DC OPERATING CONDITIONS

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

Power-Supply Voltage

4.5

5.0

5.5

V

Battery Voltage (Note 3)

2.7

3.0

3.3, 5.5

V

DC ELECTRICAL CHARACTERISTICS

(Over the operating range, unless otherwise specified.)

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

Active Supply Current

(Notes 4, 5)

150

180

µA

Active Battery Current

(Notes 4, 5, 6, 7)

1

4

µA

2.4

V

Low Output Voltage

0.4

V

Battery Switch Voltage

V

2.4

V

Note 1: Post-solder cleaning with water-washing techniques is acceptable, provided that ultrasonic vibration is not used. Such cleaning can

damage the crystal.

Note 2: Encapsulated DIP modules can be successfully processed through conventional wave-soldering techniques, as long as the temperature

of the crystal contained inside does not exceed +150°C.

Note 5: These parameters are measured under no load conditions.

Note 6: This current is the active mode current sourced from the backup supply/battery.

Note 7: Battery current increases to 450µA (typ) for 122ms (typ) for every 64 seconds.