NICHIA STS-DA1-2921F <Cat.No.140408>

5

SOLDERING

• Recommended Reflow Soldering Condition(Lead-free Solder)

140sec

Time

4

260

• Recommended Soldering Pad Pattern

• Recommended Metal Solder Stencil Aperture

(単位 Unit: mm)

0.25

0.85

0.7

0.123

0.85

0.7

0.55

* This LED is designed to be reflow soldered on to a PCB. If dip soldered or hand soldered,

Nichia cannot guarantee its reliability.

* Reflow soldering must not be performed more than twice.

* Avoid rapid cooling. Ramp down the temperature gradually from the peak temperature.

* Nitrogen reflow soldering is recommended. Air flow soldering conditions can cause optical degradation,

caused by heat and/or atmosphere.

* Since the silicone used in the encapsulating resin is soft, do not press on the encapsulant resin.

Pressure can cause nicks, chip-outs, encapsulant delamination and deformation, and bump breaks, decreasing reliability.

When using automatic pick and place machine, use a pick up nozzle which does not directly apply excess stress

to the encapsulation of the LEDs.

Recommended conditions:

Nozzle Panasonic:#10807GH811AG

JUKI:#502

(Picking on the upper surface possible)

* Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable,

a hot plate should be used.

It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing.

* When soldering, do not apply stress to the LED while the LED is hot.

* When using a pick and place machine, choose an appropriate nozzle for this product. Using a pick-and-place nozzle

with a smaller diameter than the size of the LED's emitting surface will cause damage to the emitting surface

and may also cause the LED not to illuminate.

* The recommended soldering pad pattern is designed for attachment of the LED without problems.

When precise mounting accuracy is required, such as high-density mounting, ensure that the size and shape of the pad

are suitable for the circuit design.

* Consider factors such as the reflow soldering temperature, hand soldering temperature, etc. when choosing the solder.

* When flux is used, it should be a halogen free flux. Ensure that the manufacturing process is not designed in a manner

where the flux will come in contact with the LEDs.

* Make sure that there are no issues with the type and amount of solder that is being used.

* All of the electrode pads are on the backside of this product; solder connections will not be able to be seen nor confirmed

by a normal visual inspection. When using the product, ensure that there are no issues with the soldering conditions.