NICHIA STS-DA1-2410A <Cat.No.130826>

5

SOLDERING

• Recommended Reflow Soldering Condition(Lead-free Solder)

• Recommended Hand Soldering Condition

Temperature

350°C Max

Soldering Time

3sec Max

• Recommended Soldering Pad Pattern

(単位 Unit: mm)

4

9.8

1.4

4

1.4

Blank boxes: Solder resist opening , Shaded areas: Footprint

* This LED is designed to be reflow soldered on to a PCB. If dip soldered, Nichia cannot guarantee its reliability.

* Reflow soldering must not be performed more than twice. Hand soldering must not be performed more than once.

* Avoid rapid cooling. Ramp down the temperature gradually from the peak temperature.

* Nitrogen reflow soldering is recommended. Air flow soldering conditions can cause optical degradation,

caused by heat and/or atmosphere.

* Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable,

a double-head soldering iron should be used.

It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing.

* When soldering, do not apply stress to the LED while the LED is hot.

* When using a pick and place machine, choose an appropriate nozzle for this product.

* The recommended soldering pad pattern is designed for attachment of the LED without problems.

When precise mounting accuracy is required, such as high-density mounting, ensure that the size and shape of the pad

are suitable for the circuit design.

* Consider factors such as the reflow soldering temperature, hand soldering temperature, etc. when choosing the solder.

* When flux is used, it should be a halogen free flux. Ensure that the manufacturing process is not designed in a manner

where the flux will come in contact with the LEDs.

* Make sure that there are no issues with the type and amount of solder that is being used.

120sec Max

Pre-heat

180 to 200°C

260°CMax

10sec Max

60sec Max

Above 220°C

1 to 5°C per sec