NNSW208C datasheet(15/18 Pages) NICHIA

15 / 18 page

NICHIA STS-DA1-2583E <Cat.No.130115>

RELIABILITY

(1) Tests and Results

Test

Reference

Standard

Test Conditions

Test

Duration

Failure

Criteria

Units

Failed/Tested

Resistance to

Soldering Heat

(Reflow Soldering)

JEITA ED-4701

300 301

Tsld=260°C, 10sec, 2reflows,

Precondition: 30°C, 70%RH, 168hr

0/50

Solderability

(Reflow Soldering)

JEITA ED-4701

303 303A

Tsld=245±5°C, 5sec,

Lead-free Solder(Sn-3.0Ag-0.5Cu)

0/50

Thermal Shock

JEITA ED-4701

300 307

0°C to 100°C, 15sec dwell

20cycles

0/50

Temperature Cycle

JEITA ED-4701

100 105

-40°C(30min)~25°C(5min)~

100°C(30min)~25°C(5min)

100cycles

0/50

Moisture Resistance

(Cyclic)

JEITA ED-4701

200 203

25°C~65°C~-10°C, 90%RH,

24hr per cycle

10cycles

0/50

High Temperature

Storage

JEITA ED-4701

200 201

TA=100°C

1000hours

0/50

Temperature Humidity

Storage

JEITA ED-4701

100 103

TA=60°C, RH=90%

1000hours

0/50

Low Temperature

Storage

JEITA ED-4701

200 202

TA=-40°C

1000hours

0/50

Room Temperature

Operating Life

Condition 1

TA=25°C, IF=20mA

Test board: See NOTES below

1000hours

0/50

Room Temperature

Operating Life

Condition 2

TA=25°C, IF=35mA

Test board: See NOTES below

500hours

0/50

High Temperature

Operating Life

TA=85°C, IF=8.5mA

Test board: See NOTES below

1000hours

0/50

Temperature Humidity

Operating Life

60°C, RH=90%, IF=15mA

Test board: See NOTES below

500hours

0/50

Low Temperature

Operating Life

TA=-30°C, IF=20mA

Test board: See NOTES below

1000hours

0/50

Vibration

JEITA ED-4701

400 403

200m/s2, 100~2000~100Hz,

4cycles, 4min, each X, Y, Z

48minutes

0/50

Board Bending

JEITA ED-4702B

003

1bend to a deflection of 3mm

for 5±1sec

0/50

Soldering Joint Shear

Strength

JEITA ED-4702B

002 3

5N, 10±1sec

0/50

NOTES:

1) Test board: FR4 board thickness=1.6mm, copper layer thickness=35µm, RθJA≈335°C/W

2) Measurements are performed after allowing the LEDs to return to room temperature.

(2) Failure Criteria

Criteria #

Items

Conditions

Failure Criteria

Forward Voltage(VF)

IF=20mA

>U.S.L.×1.1

Luminous Flux(ΦV)

IF=20mA

<L.S.L.×0.7

Reverse Current(IR)

VR=5V

>U.S.L.×2.0

Solderability

Less than 95% solder coverage

U.S.L. : Upper Specification Limit

L.S.L. : Lower Specification Limit

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