CYStech Electronics Corp.

Spec. No. : 794N3

Issued Date : 2011.03.14

Revised Date : 2013.09.09

Page No. : 9/ 9

MTP3LP01S3

CYStek Product Specification

SOT-323 Dimension

Millimeters

Style: Pin 1.Gate 2.Source 3.Drain

3-Lead SOT-323 Plastic

Surface Mounted Package

CYStek Package Code: S3

Date Code

Device Code

TE

AB

Marking:

Inches

Millimeters

Inches

DIM

Min.

Max.

Min.

Max.

DIM

Min.

Max.

Min.

Max.

A

0.900

1.100

0.035

0.043

E1

2.150

2.450

0.085

0.096

A1

0.000

0.100

0.000

0.004

e

0.650 TYP

0.026 TYP

A2

0.900

1.000

0.035

0.039

e1

1.200

1.400

0.047

0.055

b

0.200

0.400

0.008

0.016

L

0.525 REF

0.021 REF

c

0.080

0.150

0.003

0.006

L1

0.260

0.460

0.010

0.018

D

2.000

2.200

0.079

0.087

θ

0°

8°

0°

8°

E

1.150

1.350

0.045

0.053

2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.

3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.

Material:

• Lead: Pure tin plated.

• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.

Important Notice:

• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.

• CYStek reserves the right to make changes to its products without notice.

• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.

• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.