3

SANKEN ELECTRIC CO., LTD.

SARS02-DS

High Efficiency Snubber Diode

SARS02

February 20, 2004

Figure 1. Derating Characteristics and Mounting Conditions

1.2

1.0

0.8

0.6

0.4

0.2

0

050

100

150

t / T = 1/6

t / T = 1/3

Forward Current Derating versus Ambient Temperature

Mounted on PCB

as shown at right

Bent Pin Length

= 15 mm

Cu Land Thickness = 35 μm

Cu Land Area = 10 × 10 mm

PCB Substrate Area = 180 × 100 mm

PCB Substrate

Thickness = 1.6 mm

t / T = 1/2

Sine wave

DC

Electrical Characteristics

Characteristic

Symbol

Test Conditions

Value

Unit

Forward Voltage

0.92 (max)

V

Reverse Current

10 (max)

μA

Reverse Current (High Temperature)

50 (max)

μA

Reverse Recovery Time

2.0 to 18

μs

Thermal Resistance, Junction to Lead

Between junction and pin

15 (max)

°C/W

100 μF

20 μs

200 μs