LM7171

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SNOS760B – MAY 1999 – REVISED MARCH 2013

For example, for the LM7171 in a SOIC-8 package, the maximum power dissipation at 25°C ambient

temperature is 730 mW.

Thermal resistance,

smaller the die size and package, the higher

resistance (108°C/W) than that of 8-pin SOIC (172°C/W). Therefore, for higher dissipation capability, use an 8-

pin DIP package.

The total power dissipated in a device can be calculated as:

(3)

in the device with a load connected at the output; it is not the power dissipated by the load.

Furthermore,

supply voltage)

= (6.5 mA) × (30V) + (10 mA) × (15V

− 10V)

= 195 mW + 50 mW

= 245 mW

Application Circuit

Figure 63. Fast Instrumentation Amplifier

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