−40

−50

−60

−70

−80

−90

100k

1M

10M

f − Frequency − Hz

−100

−110

2ndHarmonic

G=2

3rdHarmonic

DISTORTION

vs

FREQUENCY

THS4011

THS4012

SLOS216E – JUNE 1999 – REVISED APRIL 2010

www.ti.com

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

AVAILABLE OPTIONS

PACKAGED DEVICES

NUMBER OF

MSOP

EVALUATION

PLASTIC SMALL

CERAMIC DIP

CHIP CARRIER

CHANNELS

SYMBOL

MODULE

(DGN)

(JG)

(FK)

1

THS4011CD

THS4011CDGN

TIACI

—

—

THS4011EVM

0°C to

70°C

2

THS4012CD

TIABY

—

—

THS4012EVM

1

THS4011ID

THS4011DGN

TIACJ

—

—

—

–40°C to

85°C

2

THS4012ID

TIABZ

—

—

—

–55°C to

1

—

—

—

THS4011MJG

THS4011MFK

—

125°C

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

website at www.ti.com.

(2)

The D and DGN packages are available taped and reeled. Add an R suffix to the device type (i.e., THS4011CDGNR).

(3)

This device is in the Product Preview stage of development. Please contact your local TI sales office for availability.

2

Submit Documentation Feedback

Copyright © 1999–2010, Texas Instruments Incorporated

Product Folder Link(s): THS4011 THS4012