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OPA832IDBVT датащи(PDF) 2 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor. Click here to check the latest version.
номер детали OPA832IDBVT
подробное описание детали  Low-Power, Single-Supply, Fixed-Gain Video Buffer Amplifier
PDF  30 Pages
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производитель  NSC [National Semiconductor (TI)]
домашняя страница  http://www.national.com
Logo NSC - National Semiconductor (TI)

OPA832IDBVT датащи(HTML) 2 Page - National Semiconductor (TI)

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OPA832
SBOS266E − JUNE 2003 − REVISED AUGUST 2008
www.ti.com
2
ABSOLUTE MAXIMUM RATINGS(1)
Power Supply
+12VDC
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Internal Power Dissipation
See Thermal Analysis
. . . . . . . . . . . . . .
Differential Input Voltage(2)
±1.2V
. . . . . . . . . . . . . . . . . . . . . . . . . . .
Input Voltage Range (Single Supply)
−0.5V to +VS + 0.3V
. . . . . . .
Storage Temperature Range: D, DBV
−65
°C to +125°C
. . . . . . . . .
Lead Temperature (soldering, 10s)
+300
°C
. . . . . . . . . . . . . . . . . . . .
Junction Temperature (TJ)
+150
°C
. . . . . . . . . . . . . . . . . . . . . . . . . . .
ESD Rating:
Human Body Model (HBM)
2000V
. . . . . . . . . . . . . . . . . . . . . . .
Charge Device Model (CDM)
1500V
. . . . . . . . . . . . . . . . . . . . .
Machine Model (MM)
200V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(1) Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods
may degrade device reliability. These are stress ratings only, and
functional operation of the device at these or any other conditions
beyond those specified is not supported.
(2) Noninverting input to internal inverting node.
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be
handled with appropriate precautions. Failure to observe
proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to
complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
PACKAGE/ORDERING INFORMATION(1)
PRODUCT
PACKAGE-LEAD
PACKAGE
DESIGNATOR
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
MARKING
ORDERING
NUMBER
TRANSPORT
MEDIA, QUANTITY
OPA832
SO-8 Surface-Mount
D
−40
°C to +85°C
OPA832
OPA832ID
Rails, 100
″
″
″
″
″
OPA832IDR
Tape and Reel, 2500
OPA832
SOT23-5
DBV
−40
°C to +85°C
A74
OPA832IDBVT
Tape and Reel, 250
″
″
″
″
″
OPA832IDBVR
Tape and Reel, 3000
(1) For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet.
PIN CONFIGURATIONS
1
2
3
5
4
Output
−V
S
Noninverting Input
+V
S
Inverting Input
A74
Pin Orientation/Package Marking
SOT23−5
400
Ω
400
Ω
1
2
3
4
8
7
6
5
NC
Inverting Input
Noninverting Input
−V
S
NC
+V
S
Output
NC
SO−8
NC = No Connection
400
Ω
400
Ω



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