FEDL9271-01

LAPIS Semiconductor

ML9271

14/16

PACKAGE DIMENSIONS

QFP64-P-1414-0.80-BK

Mirror finish

Package material

Epoxy resin

Lead frame material

42 alloy

Pin treatment

Solder plating (

J5μm)

Package weight (g)

0.87 TYP.

5

Rev. No./Last Revised

6/Feb. 23, 2001

Notes for Mounting the Surface Mount Type Package

The surface mount type packages are very susceptible to heat in reflow mounting and humidity absorbed in storage.

Therefore, before you perform reflow mounting, contact ROHM's responsible sales person for the product name,

package name, pin number, package code and desired mounting conditions (reflow method, temperature and

times).

(Unit: mm)