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AS3400 AS3410 AS3430 1v0

Data Sheet - A b s o l u t e M a x i m u m R a t i n g s

5 Absolute Maximum Ratings

Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of

the device at these or any other conditions beyond those indicated in Electrical Characteristics on page 9 is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability. The device should be operated under recommended operating

conditions.

Table 2. Absolute Maximum Ratings

Parameter

Min

Max

Units

Comments

Reference Ground

Defined as in GND

Supply terminals

-0.5

2.0

V

Applicable for pin VBAT, HPVDD

Ground terminals

-0.5

0.5

V

Applicable for pins AGND

Negative terminals

-2.0

0.5

V

Applicable for pins VNEG, VSS, HPVSS

Voltage difference at VSS terminals

-0.5

0.5

V

Applicable for pins VSS, HPVSS

Pins with protection to VBAT

VNEG

-0.5

5.0

VBAT+0.5

V

Applicable for pins CPP, CPN

Pins with protection to HPVDD

VSS

-0.5

5.0

HPVDD+0.5

V

Applicable for pins LINL/R, MICL/R, ILED, HPR,

HPL, QMICL/R, QLINL/R, IOPx, QOPx

other pins

VSS

-0.5

5

Applicable for pins MICS, VOL_CSDA,

MODE_CSCL

Input Current (latch-up immunity)

-100

100

mA

Norm: JEDEC 17

Continuous Power Dissipation

-200

mW

1. Depending on actual PCB layout and PCB used

Electrostatic Discharge

Electrostatic Discharge HBM

+/-2

kV

Norm: JEDEC JESD22-A114C

Temperature Ranges and Storage Conditions

Junction Temperature

+110

ºC

Storage Temperature Range

-55

+125

ºC

Humidity non-condensing

585

%

Moisture Sensitive Level

3

Represents a max. floor life time of 168h

Package Body Temperature

260

ºC

The reflow peak soldering temperature (body

temperature) specified is in accordance with IPC/

JEDEC J-STD-020“Moisture/Reflow Sensitivity

Classification for Non-Hermetic Solid State

Surface Mount Devices”.