поискавой системы для электроныых деталей
  Russian  ▼
ALLDATASHEETRU.COM

X  

L6924U датащи(PDF) 29 Page - STMicroelectronics

номер детали L6924U
подробное описание детали  USB compatible battery charger system with integrated power switch for Li-Ion/Li-Polymer
PDF  37 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
производитель  STMICROELECTRONICS [STMicroelectronics]
домашняя страница  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

L6924U датащи(HTML) 29 Page - STMicroelectronics

Back Button L6924U Datasheet HTML 25Page - STMicroelectronics L6924U Datasheet HTML 26Page - STMicroelectronics L6924U Datasheet HTML 27Page - STMicroelectronics L6924U Datasheet HTML 28Page - STMicroelectronics L6924U Datasheet HTML 29Page - STMicroelectronics L6924U Datasheet HTML 30Page - STMicroelectronics L6924U Datasheet HTML 31Page - STMicroelectronics L6924U Datasheet HTML 32Page - STMicroelectronics L6924U Datasheet HTML 33Page - STMicroelectronics Next Button
Zoom Inzoom in Zoom Outzoom out
 29 / 37 page
background image
L6924U
Additional applications information
Doc ID 14716 Rev 2
29/37
9
Additional applications information
9.1
Selecting the input capacitor
In most applications, a 1 µF ceramic capacitor, placed close to the VIN and VINSN pins can
be used to filter the high frequency noise.
9.2
Selecting the output capacitor
Typically, a 4.7 µF ceramic capacitor placed close to the VOUT and VOUTSN pin is enough to
keep
voltage control loop stable. This ensures proper operation of battery absent detection
in removable battery pack applications.
9.3
Layout guidelines and demonstration board
The thermal loop keeps the device at a constant temperature of approximately 120 °C which
in turn, reduces ICHG. However, in order to maximize the current capability, it is important to
ensure a good thermal path. Therefore, the exposed pad must be properly soldered to the
board and connected to the other layer through thermal vias. The recommended copper
thickness of the layers is 70
μm or more.
The exposed pad must be electrically connected to GND. Figure 22 shows the thermal
image of the board with the power dissipation of 1 W. In this instance, the temperature of the
case is 89 °C, but the junction temperature of the device is given by the following equation:
Equation 25
Where the RthJA of the device mounted on board is 75 °C/W, the power dissipated is 1 W,
and the ambient temperature is 25 °C.
In this case the junction temperature is:
Equation 26
AMB
DISS
A
THJ
J
T
P
R
T
+
×
=
C
T
J
o
100
25
1
75
=
+
×
=



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37


датащи скачать

Go To PDF Page


ссылки URL



Вашему бизинису помогли Аллдатащит?  [ DONATE ] 

Что такое Аллдатащит   |   реклама   |   контакт   |   Конфиденциальность   |   Ссылка на техническое описание    |   обмен ссыками   |   поиск по производителю
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com