CSPST08 datasheet(1/4 Pages) CALMIRCO

номер детали	CSPST08

подробное описание детали	CHIP SCALE SERIES TERMINATION ARRAY

PDF	4 Pages

Scroll/Zoom	100%

производитель	CALMIRCO [California Micro Devices Corp]

домашняя страница	http://www.calmicro.com

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1 / 4 page

11/10/2000

1

CSPST

CALIFORNIA MICRO DEVICES

215 Topaz Street, Milpitas, California 95035

Tel: (408) 263-3214

Fax: (408) 263-7846

www.calmicro.com

Chip Scale Series Termination Array

Features

• 8 or 16 integrated high frequency series

terminations

• Ultra small footprint Chip Scale Package

• Ceramic substrate

• 0.35mm Eutectic Solder Bumps, 0.65mm pitch

Product Description

The CSPST is a high performance Integrated Passive

Device (IPD) which provides series terminations suitable

for use in high speed bus applications. Eight (8) or

sixteen (16) series termination versions are provided.

These resistors provide excellent high frequency

performance in excess of 3GHz and are manufactured to

an absolute tolerance as low as ±1%. The Chip Scale

Applications

• Series resistive bus termination

• Isolated resistor array

C1300700

SCHEMATIC DIAGRAMS

Package provides an ultra small footprint for this IPD

and provides minimal parasitics compared to conven-

tional packaging. Typical bump inductance is less than

25pH. The large solder bumps and ceramic substrate

allow for standard attachment to laminate printed circuit

boards without the use of underfill.

CSPST08

R1

D

C

B

A

12

3

4

R1

D

C

B

A

12

3

4

R1

5

R1

6

R1

7

R1

8

R1

CSPST16

S

E

U

L

A

V

D

R

A

D

N

A

T

S

e

u

l

a

V

r

o

t

s

i

s

e

R2

2

=

1

R

,

Ω 3

3

,

Ω 9

3

,

Ω

7

4

,

Ω

1

5

,

Ω 6

5

,

Ω

R

e

c

n

a

r

e

l

o

T

e

t

u

l

o

s

b

A%

5

±

,

%

1

±

s

r

o

t

s

i

s

e

R

f

o

R

C

Tm

p

0

1

±

r

o

t

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/

g

n

i

t

a

R

r

e

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g

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a

R

e

r

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m

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g

n

i

t

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OC

°

5

8

o

t

C

°

0

4

–

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