Reel packing

5.Suggested thermal profile for soldering process

1. Storage environment：Temperature=5~40℃ Humidity=55±25%

2. Reflow soldering of surface-mount device

3. Reflow soldering

SODF151T-SH thru SODF157T-SH

SOD123-FL

7"

3,000

4.0

30,000

183*183*123

178

382*262*387

240,000

8.7

PACKAGE

REEL SIZE

REEL

(PCS)

COMPONENT

SPACING

(mm)

BOX

(pcs)

APPOX.

GROSS

WEIGHT

(kg)

INNER BOX

(mm)

REEL DIA.

(mm)

CARTON

SIZE

(mm)

CARTON

(PCS)

Time 25℃ to Peak Temperature

<6minutes

Time maintained above:

Profile Feature

Soldering Condition

<3℃/sec

Preheat

- Temperature Min(Tsmin)

- Temperature Max(Tsmax)

150℃

200℃

60~120sec

- Ramp-up Rate

<3sec

217℃

60-260sec

255 -0/+5℃

Time within 5℃ of actual Peak

10~30sec

Ramp-down Rate

<6℃/sec