Packaging Information

32T, 32-Lead, Plastic Thin Small Outline Package

(TSOP)

Dimensions in Millimeters and (Inches)*

JEDEC OUTLINE MO-142 BD

*Controlling dimension: millimeters

INDEX

MARK

18.5(.728)

18.3(.720)

20.2(.795)

19.8(.780)

0.25(.010)

0.15(.006)

0.50(.020)

BSC

7.50(.295)

REF

8.20(.323)

7.80(.307)

1.20(.047) MAX

0.15(.006)

0.05(.002)

0

5

REF

0.70(.028)

0.50(.020)

0.20(.008)

0.10(.004)

24C3, 24-Ball (5 x 5 array), 1.0mm Pitch,

Plastic Chip-scale Ball Grid Array (CBGA)

Dimensions in Millimeters and (Inches)*

*Controlling dimension: millimeters

A

B

C

D

E

5

432

4.0 (0.157)

0.46 (0.018)

DIA BALL TYP

4.0 (0.157)

1.40 (0.055) MAX

0.30 (0.012)

1.00 (0,039) BSC

NON-ACCUMULATIVE

1

TBD

TBD

TBD

TBD

© Atmel Corporation 1998.

Atmel Cor poration makes no warranty for the use of its products, other than those expressly contained in the

Company’s standard warranty which is detailed in Atmel’s Terms and Conditions located on the Company’s

website. The Company assumes no responsibility for any errors which may appear in this document, reserves

the right to change devices or specifications detailed herein at any time without notice, and does not make any

commitment to update the information contained herein. No licenses to patents or other intellectual proper ty of

Atmel are granted by the Company in connection with the sale of Atmel products, expressly or by implication. Atmel’s products are not

authorized for use as critical components in life suppor t devices or systems.

Atmel Headquar ters, 2325 Orchard Parkway, San Jose, CA 95131, TEL (408) 441-0311, FAX (408) 487-2600

Atmel Colorado Springs, 1150 E. Cheyenne Mtn. Blvd., Colorado Springs, CO 80906, TEL (719) 576-3300, FAX (719) 540-1759

Atmel Rousset, Zone Industrielle, 13106 Rousset Cedex, France, TEL (33) 4 42 53 60 00, FAX (33) 4 42 53 60 01

Marks bearing

Terms and product names in this document may be trademarks of others.

Printed on recycled paper.

1121A–09/98/xM