MCP120/130

DS11184D-page 14

 2001 Microchip Technology Inc.

PRODUCT IDENTIFICATION SYSTEM

To order or to obtain information (e.g., on pricing or delivery), please refer to the factory or the listed sales offices.

Sales and Support

PART NO.

X

/XX

Package

Temperature

Range

Device

Device:

MCP120:

Supervisor circuit with open drain output

MCP120T:

Supervisor circuit with open drain output

(tape & reel)

MCP130:

Supervisor circuit with open drain output and

internal pull-up resistor

MCP130T:

Supervisor circuit with open drain output and

internal pull-up resistor (tape & reel)

Voltage

270

=

2.55

300

=

2.85

315

=

3.00

450

=

4.25

460

=

4.35

475

=

4.50

485

=

4.60

Bondout Option:

(TO-92 Only)

D

=

D Bond Option (see bond option chart)

F

=

F Bond Option

G

=

G Bond Option

H

=

H Bond Option

Temperature Range:

I

=

-40

°C to +85°C (only offered in I)

Package:

SN

=

SOIC (8-lead, 150 mil body)

TO

=

TO-92 (3-lead) [offered in bags only]

TT

=

SOT-23 (3-lead) [offered in tape & reel only]

Examples:

a)

2.70V, Industrial Temp., SOIC package

b)

3.00V, Bonding Option D, Industrial Temp.,

TO-92 package

c)

3.15V, Industrial Temp., SOT-23 package

d)

4.50V, Industrial Temp., SOIC package

e)

4.60V, Bonding Option F, Industrial Temp.,

TO-92 package

f)

range of 4.50V - 4.75V, Industrial Temp.,

SOT-23 package

X

Bondout

Option

X

RESET/

RESET

Voltage

RST

RST

TO-92 with

‘D’ Bondout

TO-92 with

‘F’ Bondout

MCP120

MCP130

MCP130

RST

RST

TO-92 with

‘G’ Bondout

TO-92 with

‘H’ Bondout

MCP120

MCP130

MCP120

Data Sheets

Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom-

mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:

1.

Your local Microchip sales office

2.

The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277

3.

The Microchip Worldwide Site (www.microchip.com)

Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.

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