NLSF595

http://onsemi.com

13

PACKAGE DIMENSIONS

QFN16 3x3, 0.5P

CASE 485G−01

ISSUE F

16X

SEATING

PLANE

L

D

E

0.10 C

A

A1

e

D2

E2

b

1

4

8

9

16

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED

TERMINAL AND IS MEASURED BETWEEN

0.25 AND 0.30 MM FROM TERMINAL.

4. COPLANARITY APPLIES TO THE EXPOSED

PAD AS WELL AS THE TERMINALS.

B

A

0.10 C

TOP VIEW

SIDE VIEW

BOTTOM VIEW

PIN 1

LOCATION

0.05 C

0.05 C

(A3)

C

NOTE 4

16X

0.10 C

0.05 C

A B

NOTE 3

K

16X

L1

DETAIL A

L

ALTERNATE TERMINAL

CONSTRUCTIONS

A1

A3

L

DETAIL B

MOLD CMPD

EXPOSED Cu

ALTERNATE

CONSTRUCTIONS

DETAIL A

DETAIL B

GENERIC

MARKING DIAGRAM*

XXXXX = Specific Device Code

A

= Assembly Location

L

= Wafer Lot

Y

= Year

W

= Work Week

G

= Pb−Free Package

XXXXX

XXXXX

ALYWG

G

*This information is generic. Please refer to

device data sheet for actual part marking.

Pb−Free indicator, “G” or microdot “G”,

may or may not be present.

(Note: Microdot may be in either loca-

tion)

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

RECOMMENDED

2X

0.50

PITCH

1.84 3.30

1

DIMENSIONS: MILLIMETERS

0.58

16X

2X

0.30

16X

OUTLINE

PACKAGE

2X

2X

0.10 C A B

e/2

SOLDERING FOOTPRINT*

DIM MIN

NOM

MAX

MILLIMETERS

A

0.80

0.90

1.00

A1

0.00

0.03

0.05

A3

0.20 REF

b

0.18

0.24

0.30

D

3.00 BSC

D2

1.65

1.75

1.85

E

3.00 BSC

E2

1.65

1.75

1.85

e

0.50 BSC

K

0.18 TYP

L

0.30

0.40

0.50

L1

0.00

0.08

0.15