CSM Series

Molded Metal Plate Sensing Resistor

Stackpole Electronics, Inc.

Resistive Product Solutions

Rev Date: 04/13/2012

2

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This specification may be changed at any time without prior notice.

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Please confirm technical specifications before you order and/or use.

Test Items

Condition of Test

Test Limits

Temperature Coefficient of Resistance

+25ºC ~ +125ºC

±75 ppm/ºC

Load Life

1000 hours at rated power, 70ºC,

1.5 hours ON, 0.5 hours OFF

±1%

Short Time Overload

5 X rated power for 5 seconds

±0.5% (for 0.04 - 0.1Ω >

rated power x 2.5 for 5 seconds

Moisture No Load

85ºC, 85% RH, 1000 hours

±0.5%

Temperature Cycle

-55ºC and +155ºC, 300 cycles,

15 minuntes per extreme condition

±0.5%

Resistance to Soldering Heat

260±5ºC for 20±1 seconds

±0.5%

Solderability

245±5ºC for 2±0.5 seconds

At least 95% of surface area of electrode

must be covered with new solder

High Temperature Exposure

170ºC for 1000 hours

±0.5%

Low Temperature Storage

-55ºC for 1000 hours

±0.5%

Substrate Bending

Bending width 2mm

±1%

Insulation Resistance

100V DC for 1 minute

> 100MΩ

Ambient Temperature (ºC)

-55

100

70

170

100

80

0

-55

20

155

Ambient Temperature (ºC)

40

60

70

125

0.039

0.028

0.035

inches

1.00

0.70

0.90

mm

0.157

0.083

0.161

inches

4.00

2.10

4.10

mm

CSM2512

Type / Code

Unit

CSM0603

ab

L

Power Derating Curve:

CSM0603

CSM2512

Storage Conditions: temperature 5ºC ~ 35ºC; humidity 40% ~ 75%.

Solder Pad Dimensions

Performance Characteristics