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Revision 17920-001-10a

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AS8220A

5 Absolute Maximum Ratings

Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only.

Functional operation of the device at these or any other conditions beyond those indicated in Section 6 Electrical

Characteristics on page 6 is not implied. Exposure to absolute maximum rating conditions for extended periods may

affect device reliability.

Table 2. Absolute Maximum Ratings

Parameter

Min

Max

Units

Notes

+7.0

V

+7.0

V

DC Voltage at EN, STBN, ERRN, TxD,

RxD, TxEN, BGE, RxEN

-0.3

0.3

DC Voltage at BP and BM

-40

+50

V

Input current (latchup immunity)

-100

100

mA

According to JEDEC 78

Electrostatic discharge at bus lines BP

and BM

-4

+4

kV

According to AEC-Q100-002

Electrostatic discharge

-2

+2

kV

According to AEC-Q100-002

Transient voltage on BP, BM

-200

+200

V

According to ISO7637 part3 test pulses

a and b; class C; RL=45 W, CL= 100 pF;

(see Figure 17 on page 24).

Total power dissipation (all supplies and

outputs)

150

mW

Storage temperature

-55

+150

ºC

Junction temperature

-40

+150

ºC

Package body temperature

1

1. The reflow peak soldering temperature (body temperature) specified is in accordance with IPC/JEDEC J-STD-

020C “Moisture/Reflow Sensitivity Classification for Non-Hermetic Solid State Surface Mount Devices”. The lead

finish for Pb-free leaded packages is matte tin (100% Sn).

250

ºC

Humidity non-condensing

5

85

%