TL(RU,SU,OU,AU,YU,GU,PGU)1002A(T02)

2008-05-22

13

•

Reflow soldering (example)

• The products are evaluated using above reflow soldering conditions. No additional test is performed exceed the

condition (i.e. the condition more than (*)MAX values) as a evaluation. Please perform reflow soldering under

the above conditions.

• Please perform the first reflow soldering with reference to the above temperature profile and within 72 h of

opening the package.

• Second reflow soldering

In case of second reflow soldering should be performed within 72 h of the first reflow under the above conditions.

Storage conditions before the second reflow soldering: 30

°C, 70% RH (max)

• Make any necessary soldering corrections manually.

(only once at each soldering point)

Soldering iron: 25 W

Temperature : 300

°C or less

Time

: within 3 s

• Do not perform wave soldering.

Recommended soldering pattern

Cleaning

When cleaning is required after soldering, Toshiba recommends the following cleaning solvents.

It is confirmed that these solvents have no effect on semiconductor devices in our dipping test (under the

recommended conditions). In selecting the one for your actual usage, please perform sufficient review

on washing condition, using condition and etc.

ASAHI CLEAN AK-225AES

: (made by ASAHI GLASS)

KAO CLEAN THROUGH 750H

: (made by KAO)

PINE ALPHA ST-100S

: (made by ARAKAWA CHEMICAL)

Precaution when mounting

Do not apply force to the plastic part of the LED under high-temperature conditions.

To avoid damaging the LED plastic, do not apply friction using a hard material.

When installing the PCB in a product, ensure that the device does not come into contact with other cmponents.

1.2

1.0

1.2

(1.2)

Unit: mm

Temperature profile for Pb-free soldering (example)

Time (s)

150 to 180

°C max

4

°C/s max

5 s max

260

°C max

4

°C/s max

30 to 50 s max

230

°C

60 to 120 s max

(*)

(*)

(*)

(*)

(*)

(*)

(*)