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AS5030

Datasheet - Application In formatio n

8.10 Physical Placement of the Magnet

The best linearity can be achieved by placing the center of the magnet exactly over the defined center of the chip as shown in the drawing below:

Figure 35. Defined Chip Center and Magnet Displacement Radius

The magnet may be placed below or above the device. The distance should be chosen such that the magnetic field on the die surface is within

the specified limits. The typical distance “z” between the magnet and the package surface is 0.5mm to 1.5mm, provided the use of the

recommended magnet material and dimensions (6mm x 3mm). Larger distances are possible, as long as the required magnetic field strength

stays within the defined limits.

However, a magnetic field outside the specified range may still produce usable results, but the out-of-range condition will be indicated by

MagRngn (pin 1).

Figure 36. Vertical Placement of the Magnet

1

Defined

center

2.3975+/-0.055mm

3.2mm

3.2mm

Area of recommended maximum

magnet misalignment

2.3975+/-0.055mm

0. 77+/- 0.15mm

0. 23+/- 0.1mm

z

S

N

Package surface

Die surface