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AS1923

Datasheet - A b s o l u t e M a x i m u m R a t i n g s

5 Absolute Maximum Ratings

Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of

the device at these or any other conditions beyond those indicated in Electrical Characteristics on page 4 is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

Table 2. Absolute Maximum Ratings

Parameter

Min

Max

Units

Comments

Electrical Parameters

IN1, IN2 (Monitored Voltage), IN3, IN4 to GND

-0.3

+7

V

IN4 to GND (Device Variants M, N, O, and P, see Table 5

on page 14)

-7

+0.3

V

RESETN to GND

-0.3

+6

V

Latchup immunity

Class I Level A in accordance with EIA/JEDEC 78

Continuous Power Dissipation

Continuous Power Dissipation

696

mW

Derate 8.7mW/ºC above +70ºC

Temperature Ranges and Storage Conditions

Junction Temperature

+150

ºC

Storage Temperature Range

-55

+150

ºC

Package Body Temperature

+260

ºC

The reflow peak soldering temperature (body

temperature) specified is in accordance with IPC/JEDEC

J-STD-020 “Moisture/Reflow Sensitivity Classification for

Non-Hermetic Solid State Surface Mount Devices”.

The lead finish for Pb-free leaded packages is matte tin

(100% Sn).

Humidity non-condensing

585

%

Moisture Sensitive Level

1

Represents a max. floor life time of unlimited