2-Port USB 2.0 Hi-Speed Hub Controller

Datasheet

SMSC USB2412

19

Revision 1.3 (12-27-11)

DATASHEET

4.2.1

Pin Capacitance

4.2.2

Package Thermal Specifications

Thermal parameters are measured or estimated for devices with the exposed pad soldered to thermal

vias in a multilayer 2S2P PCB per JESD51. Thermal resistance is measured from the die to the

ambient air.

Table 4.2 Pin Capacitance

LIMITS

PARAMETER

SYMBOL

MIN

TYP

MAX

UNIT

TEST CONDITION

Clock Input

Capacitance

6

pF

All pins except USB pins and the pins

under the test tied to AC ground.

Input Capacitance

6

pF

fc = 1 MHz

VDD33 = 3.3 V

Output Capacitance

6

pF

The maximum capacitance values

include the full length of the pin pad. See

the Y dimension in Figure 6.2.

Table 4.3 28-Pin QFN Package Thermal Parameters

PARAMETER

VELOCITY

(meters/sec)

SYMBOL

VALUE

UNIT

Thermal Resistance

0

40.3

°C/W

135.2

Junction-to-Top-of-Package

0

0.5

°C/W

10.6