www.austriamicrosystems.com/Power-Management/AS1390

Revision 1.04

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AS1390A, AS1390B

Datasheet - A b s o l u t e M a x i m u m R a t i n g s

5 Absolute Maximum Ratings

Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of

the device at these or any other conditions beyond those indicated in Electrical Characteristics on page 5 is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

Table 2. Absolute Maximum Ratings

Parameter

Min

Max

Units

Notes

Electrical Parameters

VDDH to AGND

40

V

VDDL to AGND

5.0

V

VDDM to AGND

20

V

VBIAS to AGND

VDDH - 5.0

VDDH + 0.3

V

PGND to AGND

-0.3

+0.3

V

EN_BOOST, FB_2D, FB_3D, FB_BUCK

AGND - 0.3

VDD + 0.3

V

Input Current (latch-up immunity)

-100

100

mA

Norm: JEDEC 78

Electrostatic Discharge

Human Body Model @ VDDH, VDDM, LX,

VBIAS, GATE, VDDHP

4

kV

Norm: MIL 883 E method 3015

Human Body Model all other pins

2

kV

Temperature Ranges and Storage Conditions

+150

ºC

Storage Temperature Range

-65

+150

ºC

Package Body Temperature

+260

ºC

The reflow peak soldering temperature (body

temperature) specified is in accordance with IPC/

JEDEC J-STD-020 “Moisture/Reflow Sensitivity

Classification for Non-Hermetic Solid State

Surface Mount Devices”.

The lead finish for Pb-free leaded packages is

matte tin (100% Sn).

Humidity non-condensing

5

85

%

Moisture Sensitive Level

1

Represents a max. floor life time of unlimited

for 20-Pin QFN (4x4mm)

3

Represents a max. floor life time of 168h

for 16-pin SOIC