LM3886

SNAS091C – MAY 1999 – REVISED MARCH 2013

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Typical Application

*Optional components dependent upon specific design requirements. Refer to External Components Description for a

component functional description.

Figure 1. Typical Audio Amplifier Application Circuit

Connection Diagram

Top View

Preliminary: call your local Texas Instruments Sales Rep. or distributor for availability

Figure 2. TO-220 and PFM Plastic Packages

See Package Number NDJ0011B for Staggered Lead Non-Isolated Package or NDA0011B for Staggered

(1)

LM3886 is directly mounted to the heat sink using only thermal compound. If a mica washer is used in addition to thermal compound,

2

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