Material Composition Specification

TLM2D3D6 Case

Device average mass. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 144 µg

Fluctuation margin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +/-10%

www.centra lsemi.com

R1 (3-June 2011)

Component

Material

Material

Substance CAS No.

Substance

(%wt)

(µg)

(%wt)

(µg)

(ppm)

active device

doped Si

6.92%

10

Si

7440-21-3

6.92%

10

69,247

bond wire

gold

0.28%

0.4

Au

7440-57-5

0.28%

0.4

2,770

leadframe

Cu alloy

27.44%

39.63

Cu

7440-50-8

27.23%

39.33

272,350

Sn

7440-31-5

0.07%

0.1

692

Zn

7440-66-6

0.07%

0.1

692

Cr

7440-47-3

0.07%

0.1

692

die attach

silver epoxy

2.77%

4

Ag

7440-22-4

1.94%

2.8

19,389

epoxy resin

Proprietary

0.83%

1.2

8,310

encapsulation*

EMC GREEN

62.32%

90

silica (fused) 60676-86-0

52.97%

76.5

529,742

epoxy resin

29690-82-2

4.67%

6.75

46,742

phenol resin

9003-35-4

1.56%

2.25

15,581

carbon black

1333-86-4

0.19%

0.27

1,870

metal

hydroxide

1309-42-8

2.93%

4.23

29,292

plating

Ni/Pd/Au

0.26%

0.38

Ni

7440-02-0

0.25%

0.36

2,493

Pd

7440-05-3

0.01%

0.01

69

Au

7440-57-5

0.01%

0.01

69

*EMC GREEN molding compound is Halogen-Free.

Disclaimer

The information provided in this Material Composition data sheet is, to the best of our knowledge, correct. However, there is no

guarantee to completeness or accuracy, as some information is derived from data sources outside the company.