Material Composition Specification

Device average mass. . . . . . . . . . . . . . . . . . . . . . . . . . . . 1460 mg

Fluctuation margin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +/-10%

www.centra lsemi.com

R2 (3-June 2011)

Component

Material

Material

Substance CAS No.

Substance

(%wt)

(mg)

(%wt)

(mg)

(ppm)

active device

doped Si

0.44%

6.42

Si

7440-21-3

0.44%

6.42

4,397

leadframe

Cu alloy

64.56%

943

Cu

7440-50-8

64.52%

942

645,224

Fe

7439-89-6

0.03%

0.5

342

die attach

high temperature

solder paste

1.13%

16.5

Pb

7439-92-1

1.04%

15.25

10,446

Sn

7440-31-5

0.06%

0.825

565

Ag

7440-22-4

0.03%

0.412

282

encapsulation*

EMC

31.98%

467

silica

7631-86-9

21.75%

317.5

217,472

epoxy resin

29690-82-2

6.4%

93.4

63,974

phenol resin

9003-35-4

3.2%

46.67

31,967

Sb2O3

1309-64-4

0.32%

4.67

3,199

Br

7726-95-6

0.32%

4.67

3,199

EMC GREEN

31.98%

467

silica (fused) 60676-86-0

24.62%

359.5

246,240

epoxy resin

29690-82-2

3.2%

46.73

32,008

phenol resin

9003-35-4

3.1%

45.28

31,015

carbon black

1333-86-4

0.1%

1.4

959

metal

hydroxide

1309-42-8

0.96%

14.0

9,589

plating**

tin/lead process

1.89%

27.6

Sn

7440-31-5

1.7%

24.88

17,042

Pb

7439-92-1

0.19%

2.76

1,890

matte tin

1.89%

27.6

Sn

7440-31-5

1.89%

27.64

18,932

*EMC GREEN molding compound is Halogen-Free.

**For Lead Free plating, add suffix “LEAD FREE” to part number.

For Tin/Lead plating, add suffix “TIN/LEAD” to part number.

No suffix designation allows for the supply of either lead-free or tin/lead plated product depending on availability.

Disclaimer

The information provided in this Material Composition data sheet is, to the best of our knowledge, correct. However, there is no

guarantee to completeness or accuracy, as some information is derived from data sources outside the company.