PESD2CAN

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© NXP B.V. 2012. All rights reserved.

Product data sheet

Rev. 2 — 27 September 2012

9 of 13

NXP Semiconductors

PESD2CAN

CAN bus ESD protection diode

11. Soldering

Fig 12. Reflow soldering footprint SOT23 (TO-236AB)

Fig 13. Wave soldering footprint SOT23 (TO-236AB)

solder lands

solder resist

occupied area

solder paste

sot023_fr

0.5

(3

×)

0.6

(3

×)

0.6

(3

×)

0.7

(3

×)

3

1

3.3

2.9

1.7

1.9

2

Dimensions in mm

solder lands

solder resist

occupied area

preferred transport direction during soldering

sot023_fw

2.8

4.5

1.4

4.6

1.4

(2

×)

1.2

(2

×)

2.2

2.6

Dimensions in mm