Data Sheet

ADMP504

Rev. 0 | Page 9 of 12

PCB LAND PATTERN LAYOUT

The recommended PCB land pattern for the ADMP504 should

be laid out to a 1:1 ratio to the solder pads on the microphone

package, as shown in Figure 10. Take care to avoid applying

solder paste to the sound hole in the PCB. A suggested solder

paste stencil pattern layout is shown in Figure 11. The diameter

of the sound hole in the PCB should be larger than the diameter

of the sound port of the microphone. A minimum diameter of

0.5 mm is recommended.

Ø1.55

Ø0.95

1.52

0.90

1.90

1.22

0.68

0.61

0.61

Figure 10. PCB Land Pattern Layout

1.22

2×

0.8 × 0.6

0.2 × 45°

TYP

1.52mm

1.55/1.05 DIA.

0.225 CUT WIDTH (2×)

Figure 11. Suggested Solder Paste Stencil Pattern Layout