THS3001IDR datasheet(24/39 Pages) TI

24 / 39 page

D +

MAX

–T

Where:

= Maximum power dissipation of THS3001 (watts)

TMAX = Absolute maximum junction temperature (150°C)

= Free-ambient air temperature (

°C)

θJA = Thermal coefficient from die junction to ambient air (°C/W)

TA − Free-Air Temperature − °C

−20

1.5

0.5

100

−40

SOIC-D Package:

θJA = 169°C/W

TJ = 150°C

No Airflow

THS3001

SLOS217H – JULY 1998 – REVISED SEPTEMBER 2009................................................................................................................................................. www.ti.com

THERMAL INFORMATION

The THS3001 incorporates output-current-limiting protection. Should the output become shorted to ground, the

output current is automatically limited to the value given in the data sheet. While this protects the output against

excessive current, the device internal power dissipation increases due to the high current and large voltage drop

across the output transistors. Continuous output shorts are not recommended and could damage the device.

Additionally, connection of the amplifier output to one of the supply rails (±VCC) is not recommended. Failure of

the device is possible under this condition and should be avoided. But, the THS3001 does not incorporate

thermal-shutdown protection. Because of this, special attention must be paid to the device's power dissipation or

failure may result.

The thermal coefficient

θJA is approximately 169°C/W for the SOIC 8-pin D package. For a given θJA, the

maximum power dissipation, shown in Figure 55, is calculated by the following formula:

Figure 55. Maximum Power Dissipation vs Free-Air Temperature

Submit Documentation Feedback

Product Folder Link(s): THS3001

THS3001IDR датащи(PDF) 24 Page - Texas Instruments

THS3001IDR датащи(HTML) 24 Page - Texas Instruments

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39

датащи скачать

ссылки URL