ZSSC3036CC1C datasheet(2/49 Pages) ETC2

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ZSSC3036

Low-Power 16-Bit Sensor Signal Conditioner IC

stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.

For more information, contact ZMDI via mobile.sensing@zmdi.com.

Brief Description

The ZSSC3036 is a sensor signal conditioner (SSC)

integrated circuit for high-accuracy amplification and

analog-to-digital conversion of a differential input

signal. Designed for high-resolution altimeter module

applications, the ZSSC3036 can perform offset,

span, and 1

st and 2nd order temperature compen-

sation of the measured signal. Developed for correc-

tion of resistive bridge sensors, it can also provide a

corrected temperature output measured with an

internal sensor.

The measured and corrected bridge values are

provided at the digital output pins, which can be

configured as I

2C™* (≤ 3.4MHz) or SPI (≤ 20MHz).

Digital compensation of signal offset, sensitivity,

temperature, and non-linearity is accomplished via

an 18-bit internal digital signal processor (DSP) run-

ning a correction algorithm. Calibration coefficients

are stored on-chip in a highly reliable, non-volatile,

multiple-time programmable (MTP) memory. Pro-

gramming the ZSSC3036 is simple via the serial

interface. The IC-internal charge pump provides the

MTP programming voltage. The interface is used for

the PC-controlled calibration procedure, which pro-

grams the set of calibration coefficients in memory.

The ZSSC3036 provides accelerated signal process-

ing in order to support high-speed control, safety,

and real-time sensing applications. It complements

ZMDI’s additional ZSSC30x6 products.

Features

 Flexible, programmable analog front-end design;

up to 16-bit scalable, charge-balancing two-

segment analog-to-digital converter (ADC)

 Fully programmable gain amplifier accepting

sensors from 14 to 72 (linear factor)

 Internal auto-compensated temperature sensor

 Digital compensation of individual sensor offset;

st and 2nd order digital compensation of sensor

gain as well as of 1

st and 2nd order temperature

gain and offset drift

 Fast sensing: 16-bit conditioned sensor signal

measurement rate at more than 200s

-1

 Typical sensor elements can achieve accuracy of

less than ±0.10% FSO** @ -40 to 110°C

Benefits

 Integrated 18-bit calibration math DSP

 Fully corrected signal at digital output

 Layout customized for die-die bonding with

sensor for high-density chip-on-board assembly

 One-pass calibration minimizes calibration costs

 No external trimming, filter, or buffering com-

ponents required

 Highly integrated CMOS design

 Excellent for low-voltage and low-power battery

applications

 Optimized for operation in calibrated resistive

sensor modules

Physical Characteristics

 Supply voltage range: 1.8 to 3.6V

 Current consumption: 1mA (operating mode)

 Sleep State current: 50nA (typical)

 Temperature resolution: <0.003K/LSB

 Operation temperatures: –40°C to +85°C

–40°C to +110°C

 Small die size: 1.5mm²

 Delivery options: die for wafer bonding

* I

2C™ is a trademark of NXP.

** FSO = Full Scale Output.

ZSSC3036 Application Example

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