ATSAMD datasheet(16/25 Pages) ATMEL

16 / 25 page

Atmel SAM D20 [DATASHEET Summary]

42129JS–SAM–12/2013

Packaging Information

8.1

Thermal Considerations

8.1.1

Thermal Resistance Data

Table 8-1 summarizes the thermal resistance data depending on the package.

Table 8-1.

Thermal Resistance Data

8.1.2

Junction Temperature

The average chip-junction temperature, T

J, in °C can be obtained from the following equations:

Equation 1

Equation 2

where:

JA = package thermal resistance, Junction-to-ambient (°C/W), provided in Table 8-1

JC = package thermal resistance, Junction-to-case thermal resistance (°C/W), provided in Table 8-1

HEATSINK = cooling device thermal resistance (°C/W), provided in the manufacturer datasheet

D = device power consumption (W)

A = ambient temperature (°C)

From “Equation 1” , the user can derive the estimated lifetime of the chip and decide if a cooling device is necessary or

not. If a cooling device is to be fitted on the chip, “Equation 2” should be used to compute the resulting average chip-

junction temperature T

J in °C.

Package Type

32-pin TQFP

°C/W

25.8

°C/W

48-pin TQFP

78.8

°C/W

12.3

°C/W

64-pin TQFP

66.7

°C/W

11.9

°C/W

32-pin QFN

37.2

°C/W

3.1

°C/W

48-pin QFN

°C/W

11.4

°C/W

64-pin QFN

33.5

°C/W

11.2

°C/W

()

HEATSINK

()

ATSAMD датащи(PDF) 16 Page - ATMEL Corporation

ATSAMD датащи(HTML) 16 Page - ATMEL Corporation

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25

датащи скачать

ссылки URL