© 2006 Microchip Technology Inc.

DS21665C-page 11

TC2117

3-Lead Plastic Small Outline Transistor (DB) (SOT-223)

Note:

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

0.85

0.65

.033

.026

b

Lead Width

0.35

0.23

.014

.009

c

Lead Thickness

6.70

6.30

.264

.248

D

Overall Length

7.30

.287

E

Overall Width

1.80

–

.071

–

A

Overall Height

4.60 BSC

.181 BSC

e1

Outside lead pitch (basic)

2.30 BSC

.091 BSC

e

Pitch

MAX

MIN

MAX

MIN

Dimension Limits

MILLIMETERS*

INCHES

Units

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side.

Notes:

* Controlling Parameter

Molded Package Width

E1

.130

.146

3.30

3.70

.264

6.70

Tab Lead Width

b2

.114

.124

2.90

3.15

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

See ASME Y14.5M

JEDEC Equivalent TO-261 AA

Foot Length

.035

L0.90

–

–

–

.118

.030

.012

.256

.138

–

.276

3.00

–

0.30

0.76

–

3.50

6.50

7.00

NOM

NOM

Lead Angle

Mold Draft Angle, Top

Mold Draft Angle, Bottom

φ

α

β

–

0.37

–

10°

0°

10°

10°

16°

–

10°

16°

–

–

–

10°

16°

10°

16°

Molded Package Height

1.65

1.55

.063

.065

A2

.061

1.60

Standoff

–

.001

A1

.004

–

0.02

0.10

Drawing No. C04-032

Revised 09-13-05

b2

D

E1

E

e

e1

1

A

A1

A2

α

β

φ

L

b

c