MP62260DS datasheet(2/11 Pages) MPS

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MP62260/MP62261 – CURRENT-LIMITED POWER DISTRIBUTION SWITCH

MP62260/MP62261 Rev. 0.9

www.MonolithicPower.com

4/6/2010

MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited.

ORDERING INFORMATION

Part Number

Enable

Switch

Maximum

Continuous

Load Current

Typical Short-

Circuit Current

@ TA=25C

Package

Top

Marking

Free Air

Temperature (TA)

MP62260DS* Active Low

Single

SOIC8

TBD

MP62261DS Active High Single

SOIC8

TBD

-40

°C to +85°C

* For Tape & Reel, add suffix –Z (e.g. MP62260DS–Z).

For RoHS Compliant Packaging, add suffix –LF (e.g. MP62260DS–LF)

PACKAGE REFERENCE

ABSOLUTE MAXIMUM RATINGS (1)

IN .................................................-0.3V to +6.0V

EN, FLAG, OUT to GND ..............-0.3V to +6.0V

Continuous Power Dissipation (TA = +25°C)

(2)

SOIC8 ........................................................ 1.4W

Junction Temperature...............................150°C

Lead Temperature ....................................260°C

Storage Temperature............... -65°C to +150°C

Operating Junct. Temp. (TJ)..... -40°C to +125°C

Thermal Resistance

(3)

θJA

θJC

SOIC8..................................... 90 ...... 42...

°C/W

Notes:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ(MAX), the junction-to-

ambient thermal resistance θJA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD(MAX)=(TJ(MAX)-

TA)/θJA. Exceeding the maximum allowable power dissipation

will cause excessive die temperature, and the regulator will go

into thermal shutdown. Internal thermal shutdown circuitry

protects the device from permanent damage.

3) Measured on JESD51-7, 4-layer PCB.

GND

EN*

OUT

FLAG

TOP VIEW

SOIC8

MP62260/MP62261

Single-Channel

(*is active high for MP62261)

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