MP62170 datasheet(2/12 Pages) MPS

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MP62170/MP62171 –CURRENT-LIMITED POWER DISTRIBUTION SWITCH

MP62170/MP62171 Rev.0.9

www.MonolithicPower.com

1/12/2010

MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited.

ORDERING INFORMATION

Part Number

Enable

Switch

Maximum

Continuous

Load Current

Typical Short-

Circuit Current

@ TA=25C

Package

Top

Marking

Free Air

Temperature (TA)

MP62170ES

SOIC8

62170ES

MP62170EK

Active

Low

MSOP8

62170EK

MP62171ES

SOIC8

62171ES

MP62171EK

Active

High

Single

1.5A

2.3A

MSOP8

62171EK

-20

°C to +85°C

* For Tape & Reel, add suffix –Z (g. MP62170ES–Z).

For RoHS compliant packaging, add suffix –LF (e.g. MP62171ES–LF–Z)

PACKAGE REFERENCE

OUT

FLAG

GND

EN*

GND

EN*

OUT

FLAG

TOP VIEW

SOIC8

MSOP8

MP62170

Single-Channel

(* EN is active high for MP62171)

ABSOLUTE MAXIMUM RATINGS

(1)

IN .................................................-0.3V to +6.0V

EN, FLAG, OUT to GND ..............-0.3V to +6.0V

Continuous Power Dissipation (TA = +25°C)

(2)

SOIC8.........................................................1.4W

MSOP8.......................................................0.8W

Junction Temperature...............................150°C

Lead Temperature ....................................260°C

Storage Temperature............... -65°C to +150°C

Operating Junct. Temp (TJ)...... -20°C to +125°C

Thermal Resistance

(3)

θJA

θJC

SOIC8..................................... 90 ...... 42...

°C/W

MSOP8…. ............................. 150 ..... 65...

°C/W

Notes:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ (MAX), the junction-to-

ambient thermal resistance θJA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD (MAX) = (TJ

(MAX)-TA)/θJA. Exceeding the maximum allowable power

dissipation will cause excessive die temperature, and the

regulator will go into thermal shutdown. Internal thermal

shutdown circuitry protects the device from permanent

damage.

3) Measured on JESD51-7， 4-layer PCB.

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