MP44010 datasheet(2/14 Pages) MPS

2 / 14 page

MP44010 – BOUNDARY MODE PFC CONTROLLER

MP44010 Rev. 1.11

www.MonolithicPower.com

10/17/2012

MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.

ORDERING INFORMATION

Part Number

Package

Top Marking

Junction Temperature (TJ)

MP44010HS*

SOIC8

MP44010

-40

°C to +125°C

MP44010HP**

DIP8

MP44010

-40

°C to +125°C

* For Tape & Reel, add suffix –Z (e.g. MP44010HS–Z).

For RoHS compliant packaging, add suffix –LF (e.g. MP44010HS–LF–Z)

For RoHS compliant packaging, add suffix –LF (e.g. MP44010HP–LF)

PACKAGE REFERENCE

COMP

MULT

VIN

GATE

GND

ZCS

TOP VIEW

ABSOLUTE MAXIMUM RATINGS

(1)

Supply Voltage VIN ..........................-0.5V to 22V

Analog Inputs and Outputs ...............-0.3V to 8V

ZCS Max. current.......................-50mA to 10mA

Continuous Power Dissipation

(TA = +25°C)

(2)

SOIC8 ........................................................ 1.4W

DIP8…………………………………………..1.2W

Junction Temperature………………… …..150

°C

Lead Temperature (Solder).......................260

°C

Storage Temperature............... -55

°C to +150°C

Recommended Operating Conditions

(3)

Supply Voltage VIN .........................13.4V to 22V

Analog inputs and outputs .............-0.3V to 6.5V

Maximum Junction Temp. (TJ). ...............+125°C

Thermal Resistance

(4)

θJA

θJC

SOIC8 .....................................90 ...... 45 ...

°C/W

DIP8 .......................................105 ..... 45 ...

°C/W

Notes:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ(MAX), the junction-to-

ambient thermal resistance θJA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any

ambient

temperature

calculated

D(MAX)=(TJ(MAX)-TA)/θJA.

Exceeding

the

maximum

allowable power dissipation will cause excessive die

temperature, and the regulator will go into thermal shutdown.

Internal thermal shutdown circuitry protects the device from

permanent damage.

3) The device is not guaranteed to function outside of its

operating conditions.

4) Measured on JESD51-7, 4-layer PCB.

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