MP24893DQ datasheet(2/12 Pages) MPS

2 / 12 page

MP24893 – STEP DOWN WLED DRIVER WITH WIDE 6V-TO-36V INPUT VOLTAGE

MP24893 Rev.1.02

www.MonolithicPower.com

12/7/2012

MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.

ORDERING INFORMATION

Part Number

Package

Top Marking

MP24893DJ*

TSOT23-5

ABD

MP24893DQ**

QFN6 (3x3mm)

ABD

* For Tape & Reel, add suffix –Z (e.g. MP24893DJ–Z);

For RoHS Compliant Packaging, add suffix –LF (e.g. MP24893DJ–LF–Z)

* *For Tape & Reel, add suffix –Z (e.g. MP24893DQ–Z);

For RoHS Compliant Packaging, add suffix –LF (e.g. MP24893DQ–LF–Z)

PACKAGE REFERENCE

TSOT23-5

QFN6 (3x3mm)

ABSOLUTE MAXIMUM RATINGS

(1)

VIN, VSW .........................................-0.3V to +40V

VRS ..................................................VIN-5V to VIN

All Other Pins...............................-0.3V to +6.3V

Continuous Power Dissipation

(TA = +25°C)

(2)

TSOT23-5 .................................................. 1.1W

QFN6 (3x3mm) .......................................... 2.5W

Junction Temperature...............................150°C

Lead Temperature ....................................260°C

Storage Temperature............... -65°C to +150°C

Recommended Operating Conditions

(3)

Supply Voltage VIN ..............................6V to 36V

Operating Junction Temp. (TJ). -40°C to +125°C

Thermal Resistance

(4)

θJA

θJC

TSOT23-5 .............................110 ..... 55 ... °C/W

QFN6 (3x3mm) ......................50 ...... 14 ... °C/W

Notes:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ(MAX), the junction-to-

ambient thermal resistance θJA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD(MAX)=(TJ(MAX)-

TA)/ θJA. Exceeding the maximum allowable power dissipation

will cause excessive die temperature, and the regulator will go

into thermal shutdown. Internal thermal shutdown circuitry

protects the device from permanent damage.

3) The device is not guaranteed to function outside of its

operation conditions.

4) Measured on JESD51-7 4-layer board.

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