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MP6401 датащи(PDF) 3 Page - Monolithic Power Systems |
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MP6401 датащи(HTML) 3 Page - Monolithic Power Systems |
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3 / 16 page ![]() MP6401 – 300mA LDO LINEAR REGULATOR WITH INTEGRATED RESET IC MP6401 Rev. 1.0 www.MonolithicPower.com 3 9/7/2012 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited. © 2012 MPS. All Rights Reserved. PACKAGE REFERENCE TOP VIEW IN IN GND EN 1 2 3 4 OUT OUT ADJ RESET 8 7 6 5 TOP VIEW IN GND EN 1 2 3 OUT ADJ RESET 6 5 4 EN GND IN 1 2 3 6 5 4 RESET ADJ OUT TOP VIEW TQFN8 (3mm x 3mm) TQFN6 (2mm x 2mm) TSOT23-6 ABSOLUTE MAXIMUM RATINGS (1) IN, EN, OUT.................................–0.3V to + 6 V ADJ ..................................................–0.3V to 6V RESET.............................................–0.3V to 6V Continuous Power Dissipation. (TA = +25°C) (2) TQFN8 (3mm x 3mm) .............................. 2.6W TQFN6 (2mm x 2mm) ............................ 1.56W TSOT ....................................................... 0.57W Junction Temperature...............................150 °C Lead Temperature ....................................260 °C Storage Temperature.............. –65 °C to +150°C Recommended Operating Conditions (3) Supply Voltage VIN ..........................2.5V to 5.5V Operating Junct. Temp (TJ)..... –40°C to +125°C Thermal Resistance (4) θJA θJC TQFN8 (3mm x 3mm) ...........48 ...... 11 ... °C/W TQFN6 (2mm x 2mm) ...........80 ...... 16 ... °C/W TSOT .....................................220 .... 110 .. °C/W Notes: 1) Exceeding these ratings may damage the device. 2) The maximum allowable power dissipation is a function of the maximum junction temperature TJ (MAX), the junction-to-ambient thermal resistance θJA, and the ambient temperature TA. The maximum allowable continuous power dissipation at any ambient temperature is calculated by PD (MAX) = (TJ (MAX)-TA)/θJA. Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown. Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ=150 oC(TYP) and disengages at TJ=130 oC(TYP) 3) The device is not guaranteed to function outside of its operating conditions. 4) Measured on JESD51-7 4-layer board. |
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