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MP4459 датащи(PDF) 2 Page - Monolithic Power Systems |
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MP4459 датащи(HTML) 2 Page - Monolithic Power Systems |
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2 / 17 page ![]() MP4459 – 1.5A, 4MHz, 36V STEP-DOWN CONVERTER MP4459 Rev. 1.02 www.MonolithicPower.com 2 12/24/2013 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited. © 2013 MPS. All Rights Reserved. ORDERING INFORMATION Part Number* Package Top Marking MP4459DQT 3x3mm TQFN10 N4 * For Tape & Reel, add suffix –Z (e.g. MP4459DQT–Z); For RoHS, compliant packaging, add suffix –LF (e.g. MP4459DQT–LF–Z). PACKAGE REFERENCE ABSOLUTE MAXIMUM RATINGS (1) Supply Voltage (VIN).....................–0.3V to +40V Switch Voltage (VSW)............ –0.3V to VIN + 0.3V BST to SW .....................................–0.3V to +6V All Other Pins.................................–0.3V to +6V Continuous Power Dissipation (TA = +25°C) (2) 3x3mm TQFN10 ........................................ 2.5W Junction Temperature...............................150 °C Lead Temperature ....................................260 °C Storage Temperature.............. –65°C to +150 °C Recommended Operating Conditions (3) Supply Voltage VIN ...........................3.8V to 36V Output Voltage VOUT.........................0.8V to 30V Operating Junct. Temp. .......... –40 °C to +125°C Thermal Resistance (4) θJA θJC 3x3mm TQFN10 ..................... 50 ...... 12... °C/W Notes: 1) Exceeding these ratings may damage the device. 2) The maximum allowable power dissipation is a function of the maximum junction temperature TJ (MAX), the junction-to- ambient thermal resistance θJA, and the ambient temperature TA. The maximum allowable continuous power dissipation at any ambient temperature is calculated by PD (MAX) = (TJ (MAX)-TA)/θJA. Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown. Internal thermal shutdown circuitry protects the device from permanent damage. 3) The device is not guaranteed to function outside of its operating conditions. 4) Measured on JESD51-7, 4-layer PCB. TOP VIEW SW SW EN COMP FB 1 2 3 4 5 BST VIN VIN FREQ GND 10 9 8 7 6 EXPOSED PAD ON BACKSIDE |
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