MP3900DS datasheet(2/13 Pages) MPS

2 / 13 page

MP3900 – HIGH EFFICIENCY BOOST CONTROLLER

MP3900 Rev. 1.0

www.MonolithicPower.com

12/17/2013

MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited.

ORDERING INFORMATION

Part Number*

Package

Top Marking

Temperature

MP3900DK

MSOP8

3900D

MP3900DS

SOIC8

MP3900DS

–40

°C to +85°C

* For Tape & Reel, add suffix –Z (e.g. MP3900DK–Z). For RoHS compliant packaging, add suffix –LF (e.g.

MP3900DK–LF–Z)

PACKAGE REFERENCE

PGND

COMP/RUN

SGND

GATE

VCC

ISENSE

TOP VIEW

ABSOLUTE MAXIMUM RATINGS

(1)

VCC .............................................–0.3V to +12V

VCC Maximum Current............................. 30mA

ISENSE........................................–0.3V to +30V

FB .................................................–0.3V to +5V

COMP/RUN ...................................–0.3V to +3V

Continuous Power Dissipation (TA = +25°C)

(2)

MSOP8 .................................................... 0.67W

SOIC8 ........................................................ 1.1W

Junction Temperature...............................125

°C

Lead Temperature ....................................260

°C

Storage Temperature.............. –65°C to +150

°C

Recommended Operating Conditions

(3)

VCC Current .................................1mA to 25mA

Operating Temperature............. –40

°C to +85°C

Thermal Resistance

(4)

θJA

θJC

MSOP8 .................................. 150 ..... 65...

°C/W

SOIC8..................................... 90 ...... 45...

°C/W

Notes:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ (MAX), the junction-to-

ambient thermal resistance θJA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD (MAX) = (TJ

(MAX)-TA)/θJA. Exceeding the maximum allowable power

dissipation will cause excessive die temperature, and the

regulator will go into thermal shutdown. Internal thermal

shutdown circuitry protects the device from permanent

damage.

3) The device is not guaranteed to function outside of its

operating conditions.

4) Measured on JESD51-7, 4-layer PCB.

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