MP2494DS datasheet(2/11 Pages) MPS

2 / 11 page

MP2494 –2A, 55V, 100kHz STEP-DOWN CONVERTER

MP2494 Rev. 1.0

www.MonolithicPower.com

4/25/2012

MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.

ORDERING INFORMATION

Part Number

Package

Top Marking

MP2494DS*

SOIC8

MP2494DS

MP2494DN**

SOIC8E

MP2494DN

* For Tape & Reel, add suffix –Z (e.g. MP2494DS–Z);

For RoHS, compliant packaging, add suffix –LF (e.g. MP2494DS–LF–Z).

** For Tape & Reel, add suffix –Z (e.g. MP2494DN–Z);

For RoHS, compliant packaging, add suffix –LF (e.g. MP2494DN–LF–Z).

PACKAGE REFERENCE

VIN

GND

BST

TOP VIEW

EXPOSED PAD

ON BACKSIDE

CONNECT TO PIN 2

VIN

GND

BST

SOIC8

SOIC8E

ABSOLUTE MAXIMUM RATINGS (1)

Input Voltage VIN .......................................... 60V

VSW....................................... –0.3V to VIN + 0.3V

VBST ................................................... VSW + 6.5V

All Other Pins..............................–0.3V to +6.5V

Junction Temperature...............................150

°C

Lead Temperature ....................................260

°C

Storage Temperature.............. –65

°C to +150°C

Continuous Power Dissipation (TA = +25°C)

(2)

SOIC8 ...................................................... 1.38W

SOIC8E...................................................... 2.5W

Recommended Operating Conditions

(3)

Input Voltage VIN ..............................4.5V to 55V

Output Voltage VOUT.........................0.8V to 15V

Operating Junction Temp. (TJ). -40°C to +125°C

Thermal Resistance

(4)

θJA

θJC

SOIC8..................................... 90 ...... 45...

°C/W

SOIC8E .................................. 50 ...... 10...

°C/W

Notes:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ (MAX), the junction-to-

ambient thermal resistance θJA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD (MAX) = (TJ

(MAX)-TA)/θJA. Exceeding the maximum allowable power

dissipation will cause excessive die temperature, and the

regulator will go into thermal shutdown. Internal thermal

shutdown circuitry protects the device from permanent

damage.

3) The device is not guaranteed to function outside of its

operating conditions.

4) Measured on JESD51-7, 4-layer PCB.

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