MP2482 – 5A, 30V, 420kHZ STEP-DOWN CONVERTER

MP2482 Rev.1.4

www.MonolithicPower.com

11

9/21/2011

MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited.

Preliminary Specifications Subject to Change

© 2011 MPS. All Rights Reserved.

PCB Layout Guide (For SOIC8E Package)

PCB layout is very important to achieve stable

operation. Please follow these guidelines and

take Figure3 and 4 for references.

1) Keep the path of switching current short

and minimize the loop area formed by Input

cap, high-side MOSFET and schottky diode.

2) Keep the connection of schottky diode

between SW pin and input power ground

as short and wide as possible.

3) Ensure all feedback connections are short

and direct. Place the feedback resistors

and compensation components as close to

the chip as possible.

4) Route SW away from sensitive analog

areas such as FB.

5) Connect IN, SW, and especially GND

respectively to a large copper area to cool

the chip to improve thermal performance

and long-term reliability. For single layer

PCB, exposed pad should not be soldered.

GND

VCC

BST

SW

IN

EN

PG

FB

Rb

L1

D1

PGND

SGND

R1

C2

C1

Figure 3—PCB Layout for Single Layer

R4

GND

VCC

BST

SW

IN

EN

PG

FB

C1

Rb

R1

C2

L1

D1

PGND

SGND

Top Layer

SGND

Bottom Layer

Figure 4—PCB Layout for Double Layers