MP2481 datasheet(2/12 Pages) MPS

2 / 12 page

MP2481 –36V, 1.2A, 1.4MHz WHITE LED DRIVER

MP2481 Rev. 1.42

www.MonolithicPower.com

4/28/2012

MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.

ORDERING INFORMATION

Part Number*

Package

Top Marking

MP2481DH

MSOP8E

2481D

* For Tape & Reel, add suffix –Z (e.g. MP2481DH–Z).

For RoHS compliant packaging, add suffix –LF (e.g. MP2481DH–LF–Z)

PACKAGE REFERENCE

VDD

VSS

OVP

EXPOSED PAD

ON BACK SIDE

* Do not Connect to System

Ground in Buck-Boost Mode

BST

INGND

EN/DIM

TOP VIEW

ABSOLUTE MAXIMUM RATINGS (1)

Supply Voltage VDD – VSS.............................40V

VSW – VSS .............................–0.3V to VIN + 0.3V

VBST .................................................... VSW + 6V

VOVP – VSS..................................... –0.3V to +6V

VEN – VINGND .................................. –0.3V to +6V

VDIM – VINGND ................................. –0.3V to +6V

VINGND – VSS .................................. –0.3V to 40V

Continuous Power Dissipation (TA = +25°C)

(2)

………………………………………………....2.3W

Junction Temperature.............................. 150

°C

Lead Temperature ................................... 260

°C

Storage Temperature.............. –65

°C to +150°C

Recommended Operating Conditions

(3)

Supply Voltage VDD – VSS................ 4.5V to 36V

Operating Junct. Temp (TJ)..... –40°C to +125°C

Thermal Resistance

(4)

θJA

θJC

MSOP8E (Exposed Pad) ........55 ...... 12 ...

°C/W

Notes:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ (MAX), the junction-to-

ambient thermal resistance θJA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD (MAX) = (TJ

(MAX)-TA)/θJA. Exceeding the maximum allowable power

dissipation will cause excessive die temperature, and the

regulator will go into thermal shutdown. Internal thermal

shutdown circuitry protects the device from permanent

damage.

3) The device is not guaranteed to function outside of its

operating conditions.

4) Measured on JESD51-7, 4-layer PCB.

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