MP2128 datasheet(2/8 Pages) MPS

2 / 8 page

MP2128 – 3MHz, 1A SYNCHRONOUS STEP-DOWN CONVERTER

MP2128 Rev. 0.9

www.MonolithicPower.com

7/20/2009

MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited.

ORDERING INFORMATION

Part Number*

Package

Top Marking

Temperature

MP2128DT

SOT23

–40

°C to +85°C

Part Number**

Package

Top Marking

Temperature

MP2128DG

QFN8(2mmx2mm)

–40

°C to +85°C

* For Tape & Reel, add suffix –Z (eg. MP2128DT–Z). For RoHS Compliant Packaging, add suffix –LF (eg.

MP2128DT–LF–Z)

** For Tape & Reel, add suffix –Z (eg. MP2128DG–Z). For RoHS Compliant Packaging, add suffix –LF (eg.

MP2128DG–LF–Z)

PACKAGE REFERENCE

TOP VIEW

GND

TOP VIEW

AGND

PGND

SOT23

QFN8

ABSOLUTE MAXIMUM RATINGS

(1)

IN to GND ..................................–0.3V to +6.5V

SW to GND .......................... –0.3V to VIN + 0.3V

FB, EN to GND.............................–0.3V to +6.5V

Continuous Power Dissipation. (TA = +25°C)

(2)

SOT23 ..................................................... 0.57W

QFN8 (2mmx2mm) .................................... 2.5W

Junction Temperature...............................150°C

Lead Temperature ....................................260°C

Storage Temperature...............–65°C to +150°C

Recommended Operating Conditions

(3)

Supply Voltage VIN .............................2.5V to 6V

Output Voltage VOUT...........................0.6V to 6V

Operating Temperature..............–40°C to +85°C

Thermal Resistance

(4)

θJA

θJC

SOT23 ................................... 220 .... 110..

°C/W

QFN8 (2mmx2mm)................. 50 ...... 12...

°C/W

Notes:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ (MAX), the junction-to-

ambient thermal resistance θJA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD (MAX) = (TJ

(MAX)-TA)/θJA. Exceeding the maximum allowable power

dissipation will cause excessive die temperature, and the

regulator will go into thermal shutdown. Internal thermal

shutdown circuitry protects the device from permanent

damage.

3) The device is not guaranteed to function outside of its

operating conditions.

4) Measured on JESD51-7, 4-layer PCB.

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