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MP1499GD датащи(PDF) 12 Page - Monolithic Power Systems |
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MP1499GD датащи(HTML) 12 Page - Monolithic Power Systems |
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12 / 18 page ![]() MP1499 – 16V/5A PEAK SYNCHRONOUS STEP-DOWN CONVERTER MP1499 Rev. 1.0 www.MonolithicPower.com 12 7/26/2012 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited. © 2012 MPS. All Rights Reserved. exceeds the set current limit threshold. Meanwhile, output voltage starts to drop until FB is below the Under-Voltage (UV) threshold, typically 50% below the reference. Once a UV is triggered, the MP1499 enters hiccup mode to periodically restart the part. This protection mode is especially useful when the output is dead-short to ground. The average short circuit current is greatly reduced to alleviate the thermal issue and to protect the regulator. The MP1499 exits the hiccup mode once the over current condition is removed. Thermal Shutdown Thermal shutdown is implemented to prevent the chip from operating at exceedingly high temperatures. When the silicon die temperature is higher than 150°C, it shuts down the whole chip. When the temperature is lower than its lower threshold, typically 130°C, the chip is enabled again. Floating Driver and Bootstrap Charging The floating power MOSFET driver is powered by an external bootstrap capacitor. This floating driver has its own UVLO protection. This UVLO’s rising threshold is 2.2V with a hysteresis of 150mV. The bootstrap capacitor voltage is regulated internally by VIN through D1, M1, C4, L1 and C2 (Figure 6). If (VIN-VSW) is more than 5V, U1 will regulate M1 to maintain a 5V BST voltage across C4. A 10Ω resistor placed between SW and BST cap is strongly recommended to reduce SW spike voltage. R4 Figure 6—Internal Bootstrap Charging Circuit Startup and Shutdown If both VIN and EN are higher than their appropriate thresholds, the chip starts. The reference block starts first, generating stable reference voltage and currents, and then the internal regulator is enabled. The regulator provides stable supply for the remaining circuitries. Three events can shut down the chip: EN low, VIN low and thermal shutdown. In the shutdown procedure, the signaling path is first blocked to avoid any fault triggering. The COMP voltage and the internal supply rail are then pulled down. The floating driver is not subject to this shutdown command. |
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